ASU’s Fulton Schools drive semiconductor innovation with advanced research, labs and industry partnerships, shaping a skilled workforce for the future.
Microelectronics
Extended reality class prepares students for semiconductor industry
Fulton Schools Professor Umberto Celano is using extended reality technology in the classroom to enhance semiconductor metrology methods for students.
Student research supports semiconductor sustainability
ASU engineering students in the FURI program are improving environmental impacts of microelectronics through TSMC-sponsored projects.
Supercharging semiconductors with computer science
Sarma Vrudhula has been awarded a $2 million grant from the National Science Foundation to develop a new chip designed for artificial intelligence.
Cross-border semiconductor collaborations translate success
A technical language course and other workforce development efforts by ASU are set to economically benefit people and businesses in the U.S. and Mexico.
Gaining a global microelectronics perspective
ASU engineering students embarked on a new study abroad experience in Taiwan to gain a wider understanding of the history and technology of microelectronics.
Strengthening semiconductor skills
The ASU-led SWAP Hub, a U.S. Department of Defense Microelectronics Commons Hub, advances electronic technology and workforce development for national defense
Supporting students for semiconductor success
Intel funded an ASU team to implement inclusive excellence initiatives that broaden participation in semiconductor-related engineering education and careers
Making eco-friendly microelectronics
Vidya Chhabria aims to reduce VLSI computing systems’ environmental impact with tools to calculate carbon footprint from manufacturing to disposal
Putting microelectronics to the test
Professor Sule Ozev’s microelectronics testing course trains students to be electronics test engineers with help from industry experts
Building microelectronics manufacturing blueprints
Hongbin Yu leads ASU’s efforts for DARPA to develop recommendations for manufacturing 3D heterogeneously integrated microelectronics in the U.S.