Home :: Chae

Chae

Junseok Chae

  • Assistant Professor
School of Electrical, Computer, and Energy Engineering
  • Electrical Engineering
  • Bio
  • Expertise
  • Education
  • Honors & Distinctions
  • Selected Publications

Junseok Chae joined the ASU faculty in 2005. He received his MS and PhD in electrical engineering in 2000 and 2003 from the University of Michigan, Ann Arbor, respectively. From 2003 to 2005, he was a postdoctoral research fellow at WIMS (Wireless Integrated MicroSystems) – ERC (Engineering Research Center), University of Michigan. 

His areas of interests are MEMS sensors, integration of nanostructures on MEMS, MEMS packaging, and Bio-MEMS. He has published over 60 conference/journal articles and book chapters. He holds a couple of U.S. patents and is a recipient of the NSF CAREER Award on a MEMS protein sensor array.

Micro-Electro-Mechanical-Systems sensors/actuators, Micro-EMS packaging, Hybrid Integration: From Nano to Micro, Micro to Macro-worlds, Bio-MEMS.

Ph.D. Electrical Engineering
University of Michigan 2003
M.S. Electrical Engineering
University of Michigan 2000
B.S. Metallurgical Engineering
Korea University 1998

NSF CAREER award, 2009. Best poster award in IEEE International Conference on Sensors, 2007. First place prize and the Best Paper, DAC (Design Automation Conference) Student Design Contest, 2001.

J. Chae, and Y. Yang, “Separation of beta-human Chorionic Gonadotropin and Immunoglobulin G by a Miniaturized Size Exclusion Chromatography Column,” Applied Physics Letters, vol. 9 4, 173902, 2009.

J. Chae, J. Harrison, S. Je, J. Kim, and M. Kozicki, “In-Situ Tuning of Omni-Directional Micro-Electro-Mechanical-Systems Microphones to Improve Performance Fit in Hearing Aids,” Applied Physics Letters, vol. 93, 123501, 2008.

S. Choi, Y. Yang, and J. Chae, “Surface Plasmon Resonance Protein sensor Using Vroman Effect,” Biosensors and Bioelectronics, vol. 24, no. 4, 899-905, 2008

J. Chae, J. Giachino, and K. Najafi, “Fabrication and Characterization of a Wafer-Level MEMS Vacuum Package with Vertical Feedthroughs”, IEEE Journal of Microelectromechanical Systems, vol. 17, 193-200, 2008.

K. Najafi, J. Giachino, and J. Chae, “Method of Fabricating a Package with Substantially Vertical Feedthroughs for Micromachined or MEMS Devices,” U.S. Patent Office, 7,098,117.